Strength Analysis and Measurement of Polyimide Film Adhesively-bonded Al Structure

碩士 === 長庚大學 === 機械工程研究所 === 97 === Abstract The purpose of this study is to evaluate adhesive properties in polyimide film adhesively-bonded aluminum structure by experiment and finite element method. The test substrate is aluminum alloy, and the flexible material is DuPont’s Kapton film. The main w...

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Bibliographic Details
Main Authors: Yu Ju Lin, 林郁儒
Other Authors: M. Y Tsai
Format: Others
Published: 2009
Online Access:http://ndltd.ncl.edu.tw/handle/71882462061124970799