| Summary: | 碩士 === 中原大學 === 機械工程研究所 === 97 === A numerical research by computational fluid dynamic (CFD) software was performed to investigate the high-power light-emitting diodes (LED) module; furthermore, the research developed an efficient heat dissipation module with an acceptable range of error based on the experimental results.
The high-power light-emitting diodes module was composed with nine chips in ten watt which were pasted in an aluminum (Al) substrate by MCPCB technique. A heat slug in Al and Ceramic were set under the substrate. Focusing on the junction temperature, this research performed a variety of numerical simulations by CFD software, ICEPAK, and improved the performance by changing the shape of the ceramic and observing the temperature change. The main purpose is to cool down the junction temperature under 125℃, which was refer to a secure temperature.
The results showed that the error range was 5% between the simulation and the experiment. It presented that the numerical simulation was feasible and accurate. Although the temperature was cooled down in a change in shape, but, however, it was not a major effect on the junction temperature. In fact, the silver glue between the chip and the substrate actually plays an important role to affect the junction temperature. It is crucial for the heat be well-conducted from the chip to the substrate, and further, influents the life of the lamp.
In this thesis, an optimum module which cooled down the junction temperature efficiently under 125℃ was developed, and could be a reference for improving an efficient LED lamp heat dissipation module in the future.
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