A Thermal Analysis of Substrate to High Power LED in a Ceramic Lamp
碩士 === 中原大學 === 機械工程研究所 === 97 === In this study, the thermal phenomena of a LED ceramic lamp was studied by a CFD software package (ICEPAK®) and experiments. The thermal performance was simulated by the CFD software for the various substrate geometry between the LED module and the ceramic lamp. All...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/61063513175060752899 |
| Summary: | 碩士 === 中原大學 === 機械工程研究所 === 97 === In this study, the thermal phenomena of a LED ceramic lamp was studied by a CFD software package (ICEPAK®) and experiments. The thermal performance was simulated by the CFD software for the various substrate geometry between the LED module and the ceramic lamp. All the properties and parameters used in the computational simulation were determined by experiments and handbooks. The simulated results agreed well with the measured data and the deviations between simulations and measurements are within 3.9 %.
The junction temperature (Tj) of the LED lamp is related directed to the substrate geometry. The junction temperature decreases when the area of the spreader, the thickness or the thermal conductivity of the substrate increases. However, using a substrate with a higher thermal conductivity doesn’t make a significant temperature decrease due to the present of the thermal resistance of ceramic material of the lamp. The results of this study can be used as the reference for the commercial design of the LED ceramic lamp.
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