| Summary: | 碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系 === 97 === The film characterization of surface silvered polyimide film (PI-Ag film) based on self-synthesized PI film (s-BPDA/4,4’-ODA type) and commer-cial PI film (Du Pont® PI film, D-PI film, PMDA/ODA type) were suffi-ciently discussed. PI-Ag films were prepared by the base treatment, ion-exchange reaction and different reduction methods. There are four re-duction methods, including a method at elevated oven temperature at 300 oC (Method I), a method at 300 oC oven and nitrogen gas purged (Method II), in oven under the vacuum at 200 oC (Method III), and in reduction agent N,N-dimethylformamide (DMF) solution (Method IV).
The PI-Ag films were characterized by X-ray diffraction (XRD), Energy dispersive X-ray spectroscopy (EDX), Scanning electron microscopy (SEM), four probe points, UV-Visible and cross-cut tester.
A better surface properties for each PI film (self-synthesized, and com-mercialized) has been achieved by the reduction Method I. The reflectivity of these samples was higher than 75% and 70% respectively for PI film and D-PI film. Surface resistivity was 0.2 Ω/sq and 0.3 Ω/sq respectively for PI film and D-PI film. The silver layer thickness was 400 nm and 500 nm re-spectively for PI film and D-PI film. Cross-cut tester showed a good adhe-sion between PI film (or D-PI film) and silver layer on PI-Ag film.
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