A Study for the Lead Plating WettabilityWith Pb and Pb Free Solder

• Main Authors: Fu Lung Hsieh, 謝福龍
• Other Authors: 黃德成
• Format: Others
• Language: zh-TW
• Online Access: http://ndltd.ncl.edu.tw/handle/09576314736944812609

碩士 === 國立中興大學 === 資訊科學與工程學系所 === 97 === This research is to investigate the leadframe (L/F) including copper alloy and nickel-iron alloy (Alloy 42) in the integrated circuit packaging. We will compare their wetting ability by using wetting balance when the leadframs plating with pure tin, tin-lead, tin-bismith, tin-copper, tin-silver and nickel porpezite. Then, we will execute wetting balance again to know the performance variation after backing for the plating lead frames. Most researches do wetting balance by using leadframes with different type of fluxes and lead-free solders to compare with the situation of lead solder. Thus, the property of lead-free solder can be tested and verified. However, the lead-free plating leadframs is not general to be discussed. The plating of leadframe have the property of corrosion resistance, antioxidant, good solder ability and reliability. It is also prepared first for surface mount technology. Because of the trend of the world''s lead-free, the lead metal in tin-lead has to be replaced. Based on the rules from the RoHS, there are six substances like Lead (Pb), Mercury (Hg), Cadmium (Cd), Hexavalent chromium (Cr6+), Polybrominated biphenyls (PBB) and Polybrominated diphenyl ether (PBDE) should be avoid used in the electronic product after July, 2007. Thus, many countries are going to indulge into the development of finding new lead-free solder, and thus many new plating have be generated to instead of tin-lead solder. Currently, there are several plating such as pure tin, tin-lead, tin-bismith, tin-copper, tin-silver and nickel porpezite have been most adopted. To investigate the solder ability difference and reliability while comparing with tin lead alloy has been becoming an important issue. In this thesis, we collect several commercial leadframes like KFC, C151, Alloy42, E64T, C7025 and C194 materials to plate with pure tin, tin-lead, tin-bismith, tin copper, tin-silver and nickel porpezite, and then to investigate their wetting ability after plating with different types of solders and baking for each different combination.