Development of Compressive Creep Model for Lead-Free Ball Grid Array Solder Joints
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 97 === Heat sinks with fans are typically used for thermal management in state-of-the-art electronic systems for computing or telecommunication. For the purpose of improving the efficiency of heat conduction, a compressive load is usually applied to the assembly of h...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/63295716271168207771 |