Mechanical property of the micrometer Cu- and Ni- pillars and their corrosion in 3.5 wt% NaCl solution

• Main Authors: Chen-feng Huang, 黃振峰
• Other Authors: Jing-chie Lin
• Format: Others
• Language: zh-TW
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/84424272827086694211

碩士 === 國立中央大學 === 機械工程研究所 === 97 === Micrometer copper and nickel pillars were fabricated by localized electrochemical deposition (LECD) through a patented process of micro-anode guided electroplating (MAGE). Many pillars obtained by changing the electroplating parameters such as the electrical voltages and the separation between the electrodes were of concern to compare their surface morphology, internal structure, mechanical property and corrosion behavior in 3.5 wt% NaCl solution. The surface morphology and internal structure were inspected by scanning electron microscope. The mechanical properties were measured by using a micro stress tensile tester, the copper pillars maximum young’s modulus can reach to 64.6 GPa and the nickel pillars maximum young’s modulus can reach to182.3 Gpa. The corrosion behavior of the micro pillars in the 3.5 wt % saline solution was investigated by direct current electrochemical polarization and electrochemical impedance spectroscopy (EIS) study. The micrometer pillars attained at higher electric voltage reveal rougher surface, non-uniform internal, higher variation in mechanical property and are less corrosion resistant in the saline solution than those obtained at lower voltage. The pillars fabricated by LECD are more corrosion resistant than those fabricated by withdrawing process from metallic rods.