Simulating and Experimental Study on Bonding Transducer for Ultrasonic Flip Chip Bonding Process
碩士 === 國立彰化師範大學 === 機電工程學系 === 97 === This thesis aims on simulating the ultrasonic transducer for thermosonic flip chip bonding process. Resonance frequency and amplification effect of horn is discussed. Issues of bonding pressure, temperature on the substrate, ultrasonic power, and ultrasonic time...
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ndltd-TW-097NCUE54890162015-10-13T12:05:45Z http://ndltd.ncl.edu.tw/handle/24905774888566415528 Simulating and Experimental Study on Bonding Transducer for Ultrasonic Flip Chip Bonding Process 熱超音波覆晶製程之接合振動子模擬及實驗研究 蕭富升 碩士 國立彰化師範大學 機電工程學系 97 This thesis aims on simulating the ultrasonic transducer for thermosonic flip chip bonding process. Resonance frequency and amplification effect of horn is discussed. Issues of bonding pressure, temperature on the substrate, ultrasonic power, and ultrasonic time are the key parameters on bonding process. To improve the process efficiently, the horn of ultrasonic transducer must transfer and amplify the energy to the tip motion. Therefore this thesis focuses on the theorem application of ultrasonic transducer, and then simulating it with computer aided analysis GiD & ATILA software. Experimental results are verified through measurement device and set up the design process for ultrasonic horn. 黃宜正 2009 學位論文 ; thesis 61 zh-TW |
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碩士 === 國立彰化師範大學 === 機電工程學系 === 97 === This thesis aims on simulating the ultrasonic transducer for thermosonic flip chip bonding process. Resonance frequency and amplification effect of horn is discussed. Issues of bonding pressure, temperature on the substrate, ultrasonic power, and ultrasonic time are the key parameters on bonding process. To improve the process efficiently, the horn of ultrasonic transducer must transfer
and amplify the energy to the tip motion. Therefore this thesis focuses on the theorem application of ultrasonic transducer, and then simulating it with computer aided analysis GiD & ATILA software. Experimental results are
verified through measurement device and set up the design process for ultrasonic horn.
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黃宜正 |
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黃宜正 蕭富升 |
author |
蕭富升 |
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蕭富升 Simulating and Experimental Study on Bonding Transducer for Ultrasonic Flip Chip Bonding Process |
author_sort |
蕭富升 |
title |
Simulating and Experimental Study on Bonding Transducer for Ultrasonic Flip Chip Bonding Process |
title_short |
Simulating and Experimental Study on Bonding Transducer for Ultrasonic Flip Chip Bonding Process |
title_full |
Simulating and Experimental Study on Bonding Transducer for Ultrasonic Flip Chip Bonding Process |
title_fullStr |
Simulating and Experimental Study on Bonding Transducer for Ultrasonic Flip Chip Bonding Process |
title_full_unstemmed |
Simulating and Experimental Study on Bonding Transducer for Ultrasonic Flip Chip Bonding Process |
title_sort |
simulating and experimental study on bonding transducer for ultrasonic flip chip bonding process |
publishDate |
2009 |
url |
http://ndltd.ncl.edu.tw/handle/24905774888566415528 |
work_keys_str_mv |
AT xiāofùshēng simulatingandexperimentalstudyonbondingtransducerforultrasonicflipchipbondingprocess AT xiāofùshēng rèchāoyīnbōfùjīngzhìchéngzhījiēhézhèndòngzimónǐjíshíyànyánjiū |
_version_ |
1716853468764831744 |