Simulating and Experimental Study on Bonding Transducer for Ultrasonic Flip Chip Bonding Process

• Main Author: 蕭富升
• Other Authors: 黃宜正
• Format: Others
• Language: zh-TW
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/24905774888566415528

碩士 === 國立彰化師範大學 === 機電工程學系 === 97 === This thesis aims on simulating the ultrasonic transducer for thermosonic flip chip bonding process. Resonance frequency and amplification effect of horn is discussed. Issues of bonding pressure, temperature on the substrate, ultrasonic power, and ultrasonic time are the key parameters on bonding process. To improve the process efficiently, the horn of ultrasonic transducer must transfer and amplify the energy to the tip motion. Therefore this thesis focuses on the theorem application of ultrasonic transducer, and then simulating it with computer aided analysis GiD & ATILA software. Experimental results are verified through measurement device and set up the design process for ultrasonic horn.