Simulating and Experimental Study on Bonding Transducer for Ultrasonic Flip Chip Bonding Process

Simulating and Experimental Study on Bonding Transducer for Ultrasonic Flip Chip Bonding Process

碩士 === 國立彰化師範大學 === 機電工程學系 === 97 === This thesis aims on simulating the ultrasonic transducer for thermosonic flip chip bonding process. Resonance frequency and amplification effect of horn is discussed. Issues of bonding pressure, temperature on the substrate, ultrasonic power, and ultrasonic time...

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Bibliographic Details
Main Author:	蕭富升
Other Authors:	黃宜正
Format:	Others
Language:	zh-TW
Published:	2009
Online Access:	http://ndltd.ncl.edu.tw/handle/24905774888566415528

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