| Summary: | 碩士 === 國立屏東科技大學 === 工業管理系所 === 97 === The driver IC and electronic components can set up on film by chip on film(COF) product manufacture process. An application of COF is in drive IC bonding for LCD monitor. It’s more convenient than the traditional PCB and COF reach the purpose of frivolous shortness. The gap of leads of COF product is strictly. The density and precision of the COF manufacture process must be control in 40 and 5 below, respectively. Therefore, the stability of the dimension of COF product influences the assemble quality and the following product manufacture process. In general, there are 52 quality characteristics for the process of COF that need to monitor. Using multivariate statistical process control, the 12 item be extract from 52 item row data by principle component analysis. Consequently, the Hotelling’s control chart can be constructed to monitor the dimension of the product for COF manufacture process.
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