| Summary: | 碩士 === 國立屏東科技大學 === 材料工程所 === 97 === In this study, the material properties of the molding compound MD1 and MD2 applied on the five-chip module, respectively, were measured by DSC, TGA and TMA equipments. The reliability tests of the modules with different compounds were carried out. The reliability test results show the module with MD1 failed in the TC, TH and HTS tests. The major failure cause of the TC and TH tested samples is the delamination at the interface of MD1/PI passivation layer of the chip. On the other hand, the module with MD2 has passed the reliability tests.
The structural stresses of the five-chip modules with MD1 and MD2 were simulated for the TC and drop tests. Meanwhile, the interfacial shear strengths were measured for the interfaces of MD1 and MD2 with the chip passivation layers of PI and Si3N4. The shear strain energy density was also calculated from the interfacial shear test results. In comparison of the shear strain energy densities from the simulation and the experimental results, the module with MD1 failed in the TC test is due to the MD1/PI interface having the lowest shear strain energy density.
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