Reliability evaluation and structural stress simulation for temperature cycling and drop tests of the five-chip placement on module
碩士 === 國立屏東科技大學 === 材料工程所 === 97 === In this study, the material properties of the molding compound MD1 and MD2 applied on the five-chip module, respectively, were measured by DSC, TGA and TMA equipments. The reliability tests of the modules with different compounds were carried out. The reliability...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/82412869826834471365 |