| Summary: | 碩士 === 國立屏東科技大學 === 機械工程系所 === 97 === This study reports on thermal analysis of the LED module and the cooling module of the high power LED streetlight module, respectively. By the simulation results compared with the experimental results, the thermal behavior of each module is observed. According to the simulation temperature values of each module, we proposed that various ways decreased the temperature values of the modules.
In the study, we simulated temperature flied of each module by using ANSYS 8.0 software. By the boundary conditions of each module are defined that there are constant power and free convection. The analysis results of each module are solved by finite element method that there are temperature distribution, thermal flux, thermal gradient and heat flow.
For experiment, we are operating each module for a long time in normal ambient temperature and atmosphere. When the temperature of each module is steady state, we measured the temperature of each module by using the thermography and the infra-red thermometer.
The temperature results of each module shown, the results of the cooling module is made that the simulation value is 46.02 ℃ and the experimental value is 45.5 ℃. The results of the LED module is made that the simulation value is 101.33 ℃ and the experimental value is 100.7 ℃. After the simulation results are compared with the experimental results, The Error range of the LED module is within 2 % and the cooling module is within 3.5 %.
For simulation temperature values, we proposed three ways that the temperature of each module is decrease. The better way is proposed by comparing the three ways. The temperature decrease rate of the LED module is about 3.45 % by the thickness of aluminum substrate increased 1 mm. The rate of the cooling module is about 6.2 % by installing the copper heat slug.
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