Study on Tool Compensation of Polycrystalline Diamond Micro-Cavities Fabrication by Micro-EDM Scanning Process

碩士 === 國立臺北科技大學 === 機電整合研究所 === 97 === This article describes a wear compensation research with three-dimensional (3D) micro cavities machining of polycrystalline diamond (PCD) material by means of micro electro-discharge machining (μ-EDM) scanning technology. The μ-EDM machining efficiency of PCD w...

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Bibliographic Details
Main Authors: Wei-Chang Sun, 孫偉倉
Other Authors: 許東亞
Format: Others
Language:zh-TW
Published: 2009
Online Access:http://ndltd.ncl.edu.tw/handle/pvphjb
Description
Summary:碩士 === 國立臺北科技大學 === 機電整合研究所 === 97 === This article describes a wear compensation research with three-dimensional (3D) micro cavities machining of polycrystalline diamond (PCD) material by means of micro electro-discharge machining (μ-EDM) scanning technology. The μ-EDM machining efficiency of PCD was investigated with different electrode material and discharge circuits. The experimental results show that micro-grooves on PCD are formed rapidly by μ-EDM scanning with tungsten electrode and resistance capacitance (RC) discharge circuit. Moreover, combined with wire electro-discharge grinding (WEDG), micro sphere cavities and complex cavities on PCD are successfully machined by μ-EDM scanning process. The surface roughness of cavities on PCD is as small as Ra 0.2μm and the surface roughness of cavities on WC is as small as Ra 0.122μm by means of μ-EDM scanning process.