The Dicing Method for Thin Silicon Wafer
碩士 === 大同大學 === 機械工程學系(所) === 97 === The purposes of the research are mainly on yield improve, cost reduction and getting the optimum or best quality of the wafer (4mil in thickness) by re-using the existing equipment, changing the cutting method and adjusting the parameter of the platform. Whe...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/44908604210304611969 |