| Summary: | 碩士 === 元智大學 === 電機工程學系 === 97 === During the process of chip probing (CP), there should be an interface to communicate between the tester and the wafer, that is, the probe card. Probe cards are very expensive. The purpose of this thesis is to try to make a setup rule in the beginning of testing to protect the probe card and extend its lifetime. Of course, the rule cannot let the testing result overkill as a prerequisite. In the normal situation, the lifetime of the epoxy probe card depends on the needle length between the needle tip and the bent position. This thesis employs the procedure and temperature using the fuzzy membership function to control the size of probe mark on the pad to decrease aluminum trifles adhering to the needlepoint; this will affect testing quality and yield. Therefore, we can decrease the frequency of maintenance and damage to the needle tip to achieve the purpose of protection and increase in probe card lifetime. This will reduce the testing cost and increase the productivity of wafer products.
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