Integrated Capacity Planning for IC Packaging and Final Test

• Main Authors: Cheng-Ju Sun, 孫正儒
• Other Authors: James C. Chen
• Format: Others
• Language: en_US
• Published: 2010
• Online Access: http://ndltd.ncl.edu.tw/handle/jej8e5

博士 === 中原大學 === 工業與系統工程研究所 === 98 === Capacity planning system (CPS) considering the capacity and capability of machines as well as the capacity of kits is developed for integrated circuit (IC) packaging plants and final test plants. CPS consists of five modules: Work-In-Process (WIP) Pulling Module, Lot Release Module, Resource Selection Module, Workload Accumulation Module and Workload Balance Module. CPS can estimate the future loading of equipment and balance the loading of each production resource on the planning horizon. Chapter 3 and Chapter 4 show the application of CPS to IC packaging plant and final test plant, respectively. Chapter 5 develops an integrated capacity planning system for IC backend manufacturing. Chapter 6 adds Order Assignment Module to CPS and applies them to multiple backend manufacturing plants. Microsoft Visual Basic is used to develop CPS and simulation is used to evaluate its performance. The results show that CPS can effectively and efficiently balance the workload of production resources: machines, auxiliary machines and kits.