Integrated Capacity Planning for IC Packaging and Final Test
博士 === 中原大學 === 工業與系統工程研究所 === 98 === Capacity planning system (CPS) considering the capacity and capability of machines as well as the capacity of kits is developed for integrated circuit (IC) packaging plants and final test plants. CPS consists of five modules: Work-In-Process (WIP) Pulling Modul...
Main Authors: | Cheng-Ju Sun, 孫正儒 |
---|---|
Other Authors: | James C. Chen |
Format: | Others |
Language: | en_US |
Published: |
2010
|
Online Access: | http://ndltd.ncl.edu.tw/handle/jej8e5 |
Similar Items
-
The Design of Production Planning System for Integrating IC Packaging and Final Testing Processes
by: 陳益參
Published: (2004) -
A Study of Capacity Planning for IC packaging
by: Mei-Fang Hsu, et al.
Published: (2005) -
Research for Mid-term Capacity Planning of IC Packaging
by: Fenq-Ling Yeh, et al.
Published: (1999) -
Capacity Configuration Planning Problem of IC-Packaging Manufacturing
by: 盧美仁
Published: (2013) -
The selection of IC Package Assembly House and Outsourcing Capacity Planning for IC Design House
by: Wan-Ru Tsai, et al.
Published: (2004)