Improving Semiconductor Packing Process Quality by Applying SPC Control Process

碩士 === 大葉大學 === 工學院碩士在職專班 === 98 === Statistical process control technology for the industrial sector had a considerable history, it is a good tool for improved process capability and quality control, this study uses the semiconductor IC packaging forming process to introduced into SPC system.Use th...

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Bibliographic Details
Main Authors: Po-Shin Tsai, 蔡泊欣
Other Authors: Feng Min Lai
Format: Others
Language:zh-TW
Published: 2010
Online Access:http://ndltd.ncl.edu.tw/handle/44929543783351128071
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Summary:碩士 === 大葉大學 === 工學院碩士在職專班 === 98 === Statistical process control technology for the industrial sector had a considerable history, it is a good tool for improved process capability and quality control, this study uses the semiconductor IC packaging forming process to introduced into SPC system.Use the supplemented QI statistical software to establish a complete set of statistical system control method , and select the appropriate control chart type and introduced into an auto lead scan inspection machine and enhance the detection rate, enhance the control efficiency of production lines immediately. As the SPC control chart rules was abnormal it must be waiting for engineers to eliminate SPC abnormal and the waiting time is spent but most of the abnormal problem was machines or personnel practices and misjudgment, then use the ‘‘Plato’’ to collect the abnormal reasons and establish OCAP by ‘‘Plato’’ analysis, when the SPC rule is abnormal the operator can eliminate abnormal immediately by themselves and increased production flexibility. To establish ‘‘exception treatment procedure’’ by use the 8D & FMEA to solve the production line abnormal check and confirm prevent action and reduce the waste of resources with the production line because the incorrect prevent action.