Effect of smashed size and temperature for electronic component waste on gold dissolution efficiency in aqua regia

• Main Authors: Po-Jhang chen, 陳柏彰
• Other Authors: Chin-Hsing Lai
• Format: Others
• Language: zh-TW
• Published: 2010
• Online Access: http://ndltd.ncl.edu.tw/handle/94642632081359998814

碩士 === 輔英科技大學 === 環境工程與科學系碩士班 === 98 === Recently, electronic technologies have developed very well, and results in the electronic products have a short lifetime. Moreover, human life utilizes a lot of electronic products and produces a great quantity of E-wastes. E-wastes may contain several kinds of precious metals, such as Au element. In Taiwan, the natural resources are insufficient for the needs in industrial production process. The recovery of Au from electronic component wastes is worth developing technology, and the recycling technology can provide and obtain a high potential of economic benefits. This study is focused on the dissolution capability of precious metals from an electronic component waste using a different broken diameter waste via the aqua regia solution. Following the experimental results, the suitable operation parameters could be obtained and suggested in the Au recovery technology. The results showed that the best of polishing time was 30 minutes for breaking electronic component wastes. Au containing components were easy to detach from the E-wastes. The majority of Au-containing polishing diameters for electronic component wastes ranged from 100 to 200 meshes. The others of polishing diameters of electronic component wastes had a little Au component . All of polishing diameters for electronic component wastes, a 100% Au was dissolved at 30 minutes. It could be confirmed that the dissolved time for electronic component wastes in the aqua regia solution was too long in a practical treatment process in Taiwan. For 50 mesh of polishing diameter, the dissolved time could be reduced 10 minutes at a 60℃ of aqua regia solution. And ＞70, 100~200 and <200 mesh of polishing diameters could be reduced the dissolved times of 10, 3 and 8 minutes at 40℃, respectively. The results indicated that the dissolved time decreased with temperature. However, the best of polishing diameter was 50 mesh at 60℃ while considering polishing cost, time and heating energy.