Investigation of cutting glass substrates with a line-shape laser beam
碩士 === 華梵大學 === 機電工程學系博碩專班 === 98 === The aim of this paper is to study the laser breaking technique using a line-shape laser beam for LCD glass. The laser beam moves along the desired cutting path, and then the substrate will be broken into two pieces due to the thermal stress. The laser source was...
Main Authors: | Zu-Yi Chen, 陳祖益 |
---|---|
Other Authors: | Chwan-Huei Tsai |
Format: | Others |
Language: | zh-TW |
Published: |
2010
|
Online Access: | http://ndltd.ncl.edu.tw/handle/76208405684171316930 |
Similar Items
-
Laser line-etching and cutting techniques for glass substrates
by: Yan-An Chan, et al.
Published: (2015) -
Investigation of underwater laser melting and cutting for glass substrates Investigation of underwater laser melting and cutting for glass substrates
by: Chun-Ting Lin, et al.
Published: (2010) -
A study of the line source laser beam on the glass cutting
by: Yu-Jen Wang, et al.
Published: (2004) -
Investigation of Thermal Stresses in Glass Substrates by Laser Cutting
by: Chiu, Yen-Chi, et al.
Published: (2018) -
Investigation of Cooling-assisted Laser Cutting for Glass Substrates
by: Cheng Yu Chang, et al.
Published: (2007)