| Summary: | 碩士 === 義守大學 === 資訊工程學系碩士班 === 98 === Passive RFID tag typically consists of an inert carrier substrate, an antenna and a semiconductor chip. In future , qualification process of the passive RFID tags will includes in damp heat storage and liquid nitrogen environment storage tests.
In order to pass qualification tests, a passive RFID tags needs to respond to queries by a tag reader. There was an unacceptable level of failures of passive RFID tags after exposure to abnormal ambient and environment tested. We performed an evaluation of the materials, manufacturing and assembly processes and qualification testing environment to create a set of possible failure sites with associated failure modes, mechanisms and causes. A physical analysis plan was created and executed to investigate these sites of interest on as-manufactured, exposed and failed passive RFID tags. The analysis included electrical resistance measurements, cross sectioning, OM and SEM, chemical decapsulation energy and dispersive spectroscopy (EDS) analysis on cross-sections.
Based on the analysis, we found instances of poor physical contact between the semiconductor bump and antenna. The analysis of these results led to implementation of several design and assembly process changes, which resulted in high degree of improvements in reliability and performance.
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