The Study of Thin Glass Cutting Using Ultrafast Pico-second Laser

• Main Authors: Tsung-Min Tu, 杜聰敏
• Other Authors: Ming-Jer Lin
• Format: Others
• Language: zh-TW
• Published: 2010
• Online Access: http://ndltd.ncl.edu.tw/handle/36013463963856854064

碩士 === 義守大學 === 機械與自動化工程學系碩士班 === 98 === Glass cutting is an essential step in the production of display panel used in the FPD technology, lightweight PC and cellular phone touch panel. Due to the brittleness and poor thermal conduction, high quality glass cutting becomes a challenging manufacture process. Possibilities to produce quality glass cutting (Corning Eagle 2000) of thin thickness ranges from 0.7mm to 0.5mm using picoseconds (ps) laser pulses are investigated. The mechanisms of ps laser glass cutting are outlined. Optimal laser parameters for the best glass cutting results are evaluated by optical microscope. Laser ablation threshold fluence for glass is estimated to be 0.066J/cm2.Our study indicated direct quality cutting of ultra-thin glass substrate (thickness < 0.5mm for the next generation FPD industry) using high repetition rate, high pulse energy, 10 ps time-scale ultrafast laser could be the ideal choice.