| Summary: | 碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系 === 98 === Due to the European Union had officially launched the RoHS(Restriction of the use of certain Hazardous Substances in Electrical and Electronic Equipment)directions in July, 2006, it forbids using the bans lead(Pb), Cadmium(Cd), Mercury(Hg), Hexavalent Chromium(Cr+6), Polybrominated Biphenyls(PBBs) and Polybrominated biphenyl ethers(PBDEs) in electronic products. Since Pb was largely been used in Electrical and Electronic products, in order to meet the RoHS requirements of Pb-free, assembly house changed the solder material from Sn/Pb to Pb-free, and raised the IR reflow temperature from 240℃ to 260℃. The internal trace moisture of IC package cause the popcorn issue happen because of instant temperature on IR reflow, or the internal thermal stress of IC package cause the delamination happen because differences in coefficient of thermal expansion(CTE) between molding compound and IC, and cause of the IC package failure.
The purpose of this research is to choose a suitable Epoxy Molding Compound (EMC) and silver epoxy to package SOP8(150mil), hoping to enhance the reliability of IC package. First of all, choose three kinds of silver epoxy to probe into the thermal curing behavior by DSC, observe the microscopic structure by SEM, study the adhesion by Die Shear experiment as well as the influence of silver epoxy thickness on the reliability of chip. Second, further match three kinds of EMC to probe into the thermal curing behavior by DSC and observe the microscopic structure of curing EMC by SEM. Finally, use these three kinds of silver epoxy and EMC of green material to package SOP8(150mil) chip, then perform the reliability test of absorption and de-sorption, IR reflow test etc., in addition to explore its unique nature and find the best EMC and silver epoxy to meet the requirements of RoHS.
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