Improve of the De-lamination Between Substrate Solder Mask and Mold compound in Package Assembly
碩士 === 國立高雄應用科技大學 === 電機工程系 === 98 === The thesis focus on the improvement of de-lamination between substrate solder mask and epoxy mold compound in package assembly. De-lamination is a key quality Index on currently semi-conductor assembly process. If the de-lamination occurs the life time and reli...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/90142885217153738104 |