The study of electromigration failure mode in the SnAg solder bumps with thick Ni under-bump-metallization and solder-on-pad Cu pad
碩士 === 國立交通大學 === 材料科學與工程系所 === 98 === As the current density carried by solder joints becomes higher and higher, electromigration has became an critical reliability issue. In this thesis, the electromigration failure mode of SnAg solder joints with thick nickel UBM and solder-on-pad (SOP) copper pa...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/23488838554991006975 |