The Electromigration of Al(Cu)/Ni Redistribution Layer in Through Silicon Via
碩士 === 國立中央大學 === 化學工程與材料工程研究所 === 98 === For the demands of “slim and light” electronic devices, 3D-IC technique is the most important technique, and Through Silicon Via(TSV) is an important role in this technique. However, the information of reliability is rare. In this thesis, hybrid Al(Cu)-Ni co...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/46648414053790936465 |