Optimization of Processing Parameters for LED with Surface Mount Technology
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 98 === In July 2006, the legislation of RoHS(The Restriction of the use of the Hazardous Substances in Electrical and Electronic Equipment) is fully implemented in EU. Although the major industries have response and preparedness for lead-free products, but the...
Main Authors: | Kuan-ling Tseng, 曾關嶺 |
---|---|
Other Authors: | Chien, C. H. |
Format: | Others |
Language: | zh-TW |
Published: |
2010
|
Online Access: | http://ndltd.ncl.edu.tw/handle/11996848780396344978 |
Similar Items
-
Using Design of Experiment for the Parameters Optimization on Surface Mounting Technology
by: LI, JING-WUN, et al.
Published: (2018) -
Surface Mount Technology-Optimum of Solder Paste PrintProcess Parameters
by: SUN JUI-FENG, et al.
Published: (2013) -
Repair Process Improvement—Surface Mount Technology Line
by: 吳蕙芬
Published: (2012) -
Improvement A Solder Ball of Surface Mount Technology Process
by: Chin-i Chang, et al.
Published: (2011) -
A Study of Process Improvement of Surface Mount Technology for PCB
by: Hsu, Ting-Chieh, et al.
Published: (2015)