Cu Substrate Structural Difference Effect on Interfacial Reaction after Reflow with Pure Sn - Interfacial Reaction between Pure Sn and Cu Substrate with Different Grain Size
碩士 === 國立清華大學 === 材料科學工程學系 === 98 === In recent years, many studies have aimed to improve the characteristics of SAC solders by adding fourth element in SAC solder, changing to another solder alloy system, or modifying the material of under bump materialization (UBM). Besides the material selection...
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| Format: | Others |
| Language: | en_US |
| Online Access: | http://ndltd.ncl.edu.tw/handle/48732902011678789344 |