Time to improve of 2-Layer FCCL polyimide curing process

• Main Authors: Jun-kai Wang, 王俊凱
• Other Authors: Chong-Ching Chang
• Format: Others
• Language: zh-TW
• Online Access: http://ndltd.ncl.edu.tw/handle/92440265420203656104

碩士 === 國立臺南大學 === 機電系統工程研究所產碩專班 === 98 === The vigorous development of nanotechnology over the past decade.Due to polyimide excellent thermal stability has been widely used in electronic components, aerospace, optoelectronics, semiconductor and automotive composite materials needed. 2-Layer Flexible Copper Clad Laminates of composite materials, the composition of the structure of polyimide and copper foil combination, this paper aims to explore the different temperature curves of the polyamide acid of the heat and cooked into polyimide research. Thermal curing process of decline through the Rigid-bodyPendulum Rheometer to discuss the release of tension after the PI part of the physical properties, and rely on Thermogravimetry Analysis, PAA into PI can be analyzed and thermal cracking behavior of aging. Finally we improve the curing process and saving energy effect.