Study of flip chip packaging technique on high power LEDs by adopting silicon submount
碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 98 === This thesis is to by the MEMS (Micro Electro Mechanical System) produced the LED micro-package structure, and used for Flip Chip technique, components of small size and modulization. Fabricate the LED packaged circuit patterns in Silicon substrate with s...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/w37a4s |