| Summary: | 碩士 === 南台科技大學 === 化學工程與材枓工程系 === 99 === Abstract
The study was divided into two parts. In the first part, polyamic acid (PAA) precursor was synthesized by using 4, 4’-oxydianline (4, 4'-ODA) and pyromellitic dianhydride (PMDA) monomers. Then we used physical mixing process to prepare boron nitride/1-methyl-2-pyrrolidone (BN/NMP) slurry containing different amounts of BN. Then the slurry was mixed with the polyamic acid (PAA) precursor to form PAA/BN precursor and a thermal imidization process was applied to produce PI/BN composites. The analysis results showed that the thermal stability, thermal conductivity, dielectric constant of PI/BN composites were increased when the amount of BN was increased. On the contrary, the volume resistance of PI/BN composites was decreased when the amount of BN was increased. In the second part, PAA/BN solutions were prepared by using 4, 4'-ODA and PMDA monomers with various amounts of BN via an in-situ polymerization. Then a thermal imidization process was applied to prepare PI/BN composites. The analysis results showed that the glass transition temperature (Tg), thermal stability, thermal conductivity, dielectric constant of PI/BN composites were increased when the amount of BN was increased. On the contrary, the volume resistance of PI/BN composites was decreased when the amount of BN was increased. Therefore, in this study, properties of glass transition temperature, thermal decomposition, tensile strength of the PI/BN composites prepared in the second part were better than the PI/BN composites prepared in the first part.
|
|---|
