The Study about Characters of Different Electrodeposited Copper Foil in Two-Layer Flexible Copper Clad Laminates
碩士 === 南台科技大學 === 化學工程與材枓工程系 === 98 === The purpose of this study was to explore the copper foil factory in Taiwan and Japan N M Factory electrolytic copper foil substrate made of soft non-adhesive processing characteristics and mechanical properties of the difference. In this study, the thermal pre...
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ndltd-TW-098STUT80630262016-11-22T04:13:29Z http://ndltd.ncl.edu.tw/handle/88454942341090791179 The Study about Characters of Different Electrodeposited Copper Foil in Two-Layer Flexible Copper Clad Laminates 不同電解銅箔應用於無膠系軟性基板製程之探討 Wu Zhong Xin 吳忠信 碩士 南台科技大學 化學工程與材枓工程系 98 The purpose of this study was to explore the copper foil factory in Taiwan and Japan N M Factory electrolytic copper foil substrate made of soft non-adhesive processing characteristics and mechanical properties of the difference. In this study, the thermal pressure at different temperatures and different legal pressure combined speed, respectively, two kinds of electrolytic copper foil and the thermoplastic processing of non-gel matrices were combined, then the characteristics of products. Divided by the XRD analysis and comparison of two kinds of electrolytic copper foil copper foil surface composition and grain size, the product characteristics of the study include: surface defects, tensile strength and elongation, can be bending, surface roughness, the peel strength , dimensional stability. Surface roughness measured by diameter measurement, surface defects are produced by different process conditions of products and SEM analysis to observe the surface state, in order to understand the pressure resulting from twill combined, the effect of surface defects such as tears. The results showed that the purity of copper content in different organizations may affect the deflection of copper, electrolytic copper foil factory in Taiwan N, fine grain copper foil surface, so the grain between the stacked structure is more dense and relatively better ductility, tensile strength better, the relative deflection of the can were revealed better results with the insulation material made by hot pressing legal binding, may deflection of nature and will not be combined with the insulating material change. N copper foil factory in Taiwan (1350 times) than the Japanese M Factory electrolytic copper foil (831 times) better. Copper grain size differences affect the surface roughness and peel strength: the materials used in the experiment are all 0.3oz electrolytic copper foil, the same 1.0oz insulation, so under the then theoretical, the only effect of the machinery anchor effect, so the greater the surface roughness of copper foil, and its mechanical anchoring effect is greater, then the greater the response to the peel strength. Surface roughness, electrolytic copper foil factory in Japan M Rz value of about 3.0-3.60μm, Taiwan electrolytic copper foil plant N Rz value of between 3.0-3.2μm. Peeling intensity; electrolytic copper foil factory in Taiwan N average 1.20 (kgf / cm), electrolytic copper foil factory in Japan M average 1.35 (kgf / cm). From the above data showed that in terms of available deflection N Taiwan, Japanfactory electrolytic copper foil is higher than in M plants electrolytic copper foil to the well, together with Taiwan, the price of electrolytic copper foil plant N than M plants in Japan to a low electrolytic copper foil, and the appearance of undesirable defects on the mechanical and electrical properties of no significant impact, while Taiwan's electronics industry, Taiwan may consider applying to replace the production of electrolytic copper foil factory in Japan M substrate with thermoplastic rubber processing do not combine to can reduce costs and improve Taiwan's non-adhesive soft copper substrate international competitiveness. Liao Wei-Tung 廖渭銅 2010 學位論文 ; thesis 57 zh-TW |
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碩士 === 南台科技大學 === 化學工程與材枓工程系 === 98 === The purpose of this study was to explore the copper foil factory in Taiwan and Japan N M Factory electrolytic copper foil substrate made of soft non-adhesive processing characteristics and mechanical properties of the difference.
In this study, the thermal pressure at different temperatures and different legal pressure combined speed, respectively, two kinds of electrolytic copper foil and the thermoplastic processing of non-gel matrices were combined, then the characteristics of products. Divided by the XRD analysis and comparison of two kinds of electrolytic copper foil copper foil surface composition and grain size, the product characteristics of the study include: surface defects, tensile strength and elongation, can be bending, surface roughness, the peel strength , dimensional stability. Surface roughness measured by diameter measurement, surface defects are produced by different process conditions of products and SEM analysis to observe the surface state, in order to understand the pressure resulting from twill combined, the effect of surface defects such as tears.
The results showed that the purity of copper content in different organizations may affect the deflection of copper, electrolytic copper foil factory in Taiwan N, fine grain copper foil surface, so the grain between the stacked structure is more dense and relatively better ductility, tensile strength better, the relative deflection of the can were revealed better results with the insulation material made by hot pressing legal binding, may deflection of nature and will not be combined with the insulating material change. N copper foil factory in Taiwan (1350 times) than the Japanese M Factory electrolytic copper foil (831 times) better.
Copper grain size differences affect the surface roughness and peel strength: the materials used in the experiment are all 0.3oz electrolytic copper foil, the same 1.0oz insulation, so under the then theoretical, the only effect of the machinery anchor effect, so the greater the surface roughness of copper foil, and its mechanical anchoring effect is greater, then the greater the response to the peel strength. Surface roughness, electrolytic copper foil factory in Japan M Rz value of about 3.0-3.60μm, Taiwan electrolytic copper foil plant N Rz value of between 3.0-3.2μm. Peeling intensity; electrolytic copper foil factory in Taiwan N average 1.20 (kgf / cm), electrolytic copper foil factory in Japan M average 1.35 (kgf / cm).
From the above data showed that in terms of available deflection N Taiwan, Japanfactory electrolytic copper foil is higher than in M plants electrolytic copper foil to the well, together with Taiwan, the price of electrolytic copper foil plant N than M plants in Japan to a low electrolytic copper foil, and the appearance of undesirable defects on the mechanical and electrical properties of no significant impact, while Taiwan's electronics industry, Taiwan may consider applying to replace the production of electrolytic copper foil factory in Japan M substrate with thermoplastic rubber processing do not combine to can reduce costs and improve Taiwan's non-adhesive soft copper substrate international competitiveness.
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author2 |
Liao Wei-Tung |
author_facet |
Liao Wei-Tung Wu Zhong Xin 吳忠信 |
author |
Wu Zhong Xin 吳忠信 |
spellingShingle |
Wu Zhong Xin 吳忠信 The Study about Characters of Different Electrodeposited Copper Foil in Two-Layer Flexible Copper Clad Laminates |
author_sort |
Wu Zhong Xin |
title |
The Study about Characters of Different Electrodeposited Copper Foil in Two-Layer Flexible Copper Clad Laminates |
title_short |
The Study about Characters of Different Electrodeposited Copper Foil in Two-Layer Flexible Copper Clad Laminates |
title_full |
The Study about Characters of Different Electrodeposited Copper Foil in Two-Layer Flexible Copper Clad Laminates |
title_fullStr |
The Study about Characters of Different Electrodeposited Copper Foil in Two-Layer Flexible Copper Clad Laminates |
title_full_unstemmed |
The Study about Characters of Different Electrodeposited Copper Foil in Two-Layer Flexible Copper Clad Laminates |
title_sort |
study about characters of different electrodeposited copper foil in two-layer flexible copper clad laminates |
publishDate |
2010 |
url |
http://ndltd.ncl.edu.tw/handle/88454942341090791179 |
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