| Summary: | 碩士 === 國防大學理工學院 === 光電工程碩士班 === 99 === Interlaced 320×256 focal plane arrays (FPAs) and the 320×256 QWIP FPA hybridized with DI snapshot-mode readout integrated circuit (ROIC) were in proposed the testing condition with IR optical cold spectral filters of the 2.9~ 5.5 μm and 6.5~ 14.5 μm for the dual-band IR detections respectively. The testing scheme for thermal imaging uniformity of the InAs/GaAs QWIP FPA has been proposed and calibrated by using a plane-typed blackbody source of the highest temperature of 313±1 K and lowest temperature of 293 K for the two-point temperature correction/calibration, Respectively. For the detection mid-wavelength and long-wavelength at temperature 11 K and 60 K, the average integration times for the maximum intensity of 1 / 3, 1 / 2, 2 / 3,are used for infrared thermal imaging uniformity for two-point temperature calibration ( high temperature point of 313 K and low temperature point of 293 K) for noise equivalent temperature difference (Noise Equivalent Temperature Difference, NEDT) The operation in uncorrection the uniformity of uncorrection is about 2 to 3% and corrected uniformity is less than 1% in the detection is and mid-wavelength 11 K. The noise equivalent temperature difference about 25 mK, 11 K long-wavelength about 15 mK, the temperature 60 K, mid-wavelength of noise equivalent temperature difference about 115 mK, the long-wavelength about 30 mK, Compare with the circuit board made by man-made and foreign Cedip image board verification, the performance of U&U board for noise suppression is better than Cedip circuit boards.Using the U&U image board canachieve NTSC and digital IEEE 1394 output.The integration time can be adjusted to the minimum value of 0.25 ms, however, Cedip video board can be fine-tunned 1 us integration time.
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