The effect of Probing contact on Chip Test

• Main Authors: Shin-Chung Chen, 陳世宗
• Other Authors: Shan-Ming Lan
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/73848345623508503686

碩士 === 中原大學 === 電子工程研究所 === 99 === IC test can be divided into wafer testing(Wafer Probing) and the final test (Final Testing) in two parts, which is in the wafer testing prior to the probe IC do not package a simple functional test to avoid the bad products, reduce unnecessary packaging cost input; product testing is IC after packaging, used to confirm IC function, speed, tolerance, whether the normal power consumption, and therefore, This stage the test items and the complexity of larger than the former, the test machine used is relatively high, the product can be shipped to user action prior to the most important checks on the various plants in IC factory, but also represents the possibility of sustained accumulation of goodwill, not so bad items fall into the hands of customers. This article focuses on analyzing the impact of wafer test yield because, for these reasons to further explore and propose measures to improve the whole process of probing the electrical conductivity, is the probe conducted by the probe card to the chip, contact poor are often the main cause of instability caused by the test, but excessive pressure will cause the chip pin or the aluminum pad damaged. Wafer test probe card is supported by thousands of fine wool, such as hair dressers in the probe, to measure the performance of the circuit wafer on the wafer circuit to detect whether there are flaws. As the VLSI fabrication technology advances, integrated circuits density increases, more to the smaller size of electronic components, is more for the more detailed probe, probe the problem of stress and seriously affect the reliability and lifetime cost of wafer test. As the wear and pollution, probe contact resistance varies with the number of probe gradually increased and performance degradation caused by probes. Therefore probe contact resistance is the main factor affecting probe life.