The effect of Probing contact on Chip Test
碩士 === 中原大學 === 電子工程研究所 === 99 === IC test can be divided into wafer testing(Wafer Probing) and the final test (Final Testing) in two parts, which is in the wafer testing prior to the probe IC do not package a simple functional test to avoid the bad products, reduce unnecessary packaging cost input;...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/73848345623508503686 |