| Summary: | 碩士 === 逢甲大學 === 工業工程與系統管理學研究所 === 99 === Today''s high-tech products are out-dated tomorrow. In order to make the products be more competitive in electronic industry. The efficacy of the product need to be raised and the cost need to be compressed. Therefore, the cost of waste in the process of product development has been valued nowadays. This research chose QFD as the major analysis method to make the products satisfy the customers. On the other hand, reduce the cost that caused by customer complaint cases and ineffective research and development to make the products be more competitive.
QFD (Quality Function Deployment) compiles the customer complaints cases to VOC (Voice of Customer). On the other hand, it signifies the concept of CE (Concurrent Engineering) to meet the customer needs and come up with VOE (Voice of Engineering) which are the technical features of the product. It sieves out the key quality items that meet the customer needs from those technical items through QFD.
This research takes the T Company that develops thermosetting solder mask for example to overcome the problems happened in the process of product development. After clarified the key items and the objective, it builds up the test items and test procedure. Through these key test items and test procedure, they do feature classification of the products in order for the customers to choose the suitable product and avoid defective products. Through the test procedure, they visibly reduce the customer complaint cases from 18 per month to below 5 per month. Furthermore, T Company does the revise of the formula then develops the best formula that meets those test items and greatly promotes the customer satisfaction of this product.
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