Optimal Design of Stress-induced Voiding Phenomena in Single Damascene Copper Interconnect Through Response Surface Method with Genetic Algorithm

碩士 === 國立成功大學 === 工程科學系碩博士班 === 99

Bibliographic Details
Main Authors: Chun-HaoChuang, 莊峻豪
Other Authors: Rong-Sheng Chen
Format: Others
Language:zh-TW
Published: 2011
Online Access:http://ndltd.ncl.edu.tw/handle/97726978252027468843

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