Study and Optimization of the bump distribution to accelerate the underfill flow in Flip Chip Package
碩士 === 國立成功大學 === 航空太空工程學系碩博士班 === 99
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/07332198822974157342 |