Study and Optimization of the bump distribution to accelerate the underfill flow in Flip Chip Package
碩士 === 國立成功大學 === 航空太空工程學系碩博士班 === 99
Main Authors: | Shih-WeiLin, 林世偉 |
---|---|
Other Authors: | Wen-Bin Young |
Format: | Others |
Language: | zh-TW |
Published: |
2011
|
Online Access: | http://ndltd.ncl.edu.tw/handle/07332198822974157342 |
Similar Items
-
Flow Analysis for Underfill of Flip-Chip Packages
by: Cheng-Chang Lai, et al.
Published: (2004) -
The Optimization of Underfill Material for Flip Chip Packaging
by: I-Liang Chen, et al.
Published: (2008) -
Observation of the Filling Flow of Underfill Encapsulation in Flip Chip Package
by: Meng-Fu Shih, et al.
Published: (2008) -
Molded Underfill for Flip Chip Package
by: Yu-KaiChen, et al.
Published: (2013) -
Analysis of the Filling Flow of Underfill Encapsulation in Flip Chip Package
by: Sing-Wei Peng, et al.
Published: (2009)