Generic Integer Linear Programming Formulation for 3D IC Partitioning

碩士 === 國立交通大學 === 電子研究所 === 99 === As technology advances, 3D IC has gradually become a trend, because it is a novel technology, it requires new EDA technology, and partitioning is one of important items. This paper focus on partitioning from the architectural level, in order to maximize its benef...

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Main Authors: Mei, Tsung-Wan, 梅宗菀
Other Authors: Jiang, Iris Hui-Ru
Format: Others
Language:zh-TW
Published: 2010
Online Access:http://ndltd.ncl.edu.tw/handle/30985216131621011683
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spelling ndltd-TW-099NCTU54281092015-10-13T20:37:08Z http://ndltd.ncl.edu.tw/handle/30985216131621011683 Generic Integer Linear Programming Formulation for 3D IC Partitioning 適用於三維積體電路之線性規劃 Mei, Tsung-Wan 梅宗菀 碩士 國立交通大學 電子研究所 99 As technology advances, 3D IC has gradually become a trend, because it is a novel technology, it requires new EDA technology, and partitioning is one of important items. This paper focus on partitioning from the architectural level, in order to maximize its benefit. First, we use the logical operators to solve the problem of 3D IC partitioning, and converted into integer linear programs (ILPs). Our ILP formulation can reduce the number of TSV and power, and because of its flexibility, it can be expanded to support multiple supply voltage designs. We propose two methods to speed up the ILP computation, Experimental results show that our method can effectively reduce the ILP computation time. In addition, our method also has great flexibility in space, by restrictions on changes or new ILP formula can easily be extended to different target partitioning problem. This flexibility makes the ILP formula we can easily solve the general 3D IC partitioning problem. Jiang, Iris Hui-Ru 江蕙如 2010 學位論文 ; thesis 33 zh-TW
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language zh-TW
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description 碩士 === 國立交通大學 === 電子研究所 === 99 === As technology advances, 3D IC has gradually become a trend, because it is a novel technology, it requires new EDA technology, and partitioning is one of important items. This paper focus on partitioning from the architectural level, in order to maximize its benefit. First, we use the logical operators to solve the problem of 3D IC partitioning, and converted into integer linear programs (ILPs). Our ILP formulation can reduce the number of TSV and power, and because of its flexibility, it can be expanded to support multiple supply voltage designs. We propose two methods to speed up the ILP computation, Experimental results show that our method can effectively reduce the ILP computation time. In addition, our method also has great flexibility in space, by restrictions on changes or new ILP formula can easily be extended to different target partitioning problem. This flexibility makes the ILP formula we can easily solve the general 3D IC partitioning problem.
author2 Jiang, Iris Hui-Ru
author_facet Jiang, Iris Hui-Ru
Mei, Tsung-Wan
梅宗菀
author Mei, Tsung-Wan
梅宗菀
spellingShingle Mei, Tsung-Wan
梅宗菀
Generic Integer Linear Programming Formulation for 3D IC Partitioning
author_sort Mei, Tsung-Wan
title Generic Integer Linear Programming Formulation for 3D IC Partitioning
title_short Generic Integer Linear Programming Formulation for 3D IC Partitioning
title_full Generic Integer Linear Programming Formulation for 3D IC Partitioning
title_fullStr Generic Integer Linear Programming Formulation for 3D IC Partitioning
title_full_unstemmed Generic Integer Linear Programming Formulation for 3D IC Partitioning
title_sort generic integer linear programming formulation for 3d ic partitioning
publishDate 2010
url http://ndltd.ncl.edu.tw/handle/30985216131621011683
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