An analysis on Micro-Channel Cooling and Optimal Design for IGBT

• Main Author: 陳駿傑
• Other Authors: Jenn-Der Lin
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/37514188829280674014

碩士 === 國立交通大學 === 機械工程學系 === 99 === This study purposes to investigate in detail the heat transfer at various values of Reynolds number, flow channel height and width, and channel spacing of double-tier and triple--tier flow channels, in order to achieve optimal design for heat dissipation of Insulate Gate Bipolar Transistors (IGBT). In practice, the divergence and/or convergence of fluid flows may occur in the micro-fluidic system, especially at the entrance and outlet of the channel structure of the systems, and the bubbles may be formed which will subsequently lead to significant decrease in the heat dissipation. In this study, we also address the issue of the bubbles formation in the micro-fluidic system, so that we may prevent the bubbles formation in the optimal design of heat dissipation for IGBT. We design the experiments in three different angles of convergence cannels and visualize the formation of the bubbles in channel structure. The results show that the multi-layer micro-fluidic structure, compared to the traditional single-layer micro-channel heat sink, may reduce the thermal resistance by at least 15%. At the ratio (γ) of three-tier structure of micro-flow channel width and spacing equal to 0.8; the heat resistance is the lowest. While the chips are too dense, the heat transfer rate would be depressed. The experimental results also show that at the convergence angle of the flow channel at the intersection equal to 240°, the volume of the bubble formed in the channel structure would be the largest.