Transport-layer Assisted Routing Algorithm and Architectures for Thermal-Aware 3D NoC
碩士 === 國立臺灣大學 === 電子工程學研究所 === 99 === In this thesis, we proposed algorithm and architecture design for performance reduction in thermal-aware 3D network-on-chip (NoC). To ensure thermal safety and avoid huge performance back-off from the temperature constraint, run time thermal management is requir...
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| Format: | Others |
| Language: | en_US |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/17587684156245517313 |