Analysis of Optimum Configuration Change of the Semiconductor Pellets of Thermoelectric Modules
碩士 === 國立虎尾科技大學 === 機械與機電工程研究所 === 99 === The study simulates the influence on the performance of a thermoelectric cooling chip by using finite-element analysis software COMSOL Multiphysics. The simulated data are compared with experimental results for the commercial thermoelectric modules TEC1-1...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/ve2735 |