Study of Electroless Deposition Parameters on the Deposition of Copper Sulfide Nano-particle
碩士 === 大同大學 === 材料工程學系(所) === 99 === In this research, the copper sulfide nanoparticle was prepared by electroless deposition which was dividing to a series of time. The reduction agents NaHSO3 (weak reduction) and Na2S2O3.5H2O (strong reduction) were added into cupric solution to precipitated parti...
Main Authors: | Yu-Min Fan, 范裕旻 |
---|---|
Other Authors: | Chi-Yuan Huang |
Format: | Others |
Language: | en_US |
Published: |
2011
|
Online Access: | http://ndltd.ncl.edu.tw/handle/38520547657316038438 |
Similar Items
-
The application of Pd nano particles for electroless copper layer deposition in PCB
by: HSIEH,CHUNG-JEN, et al.
Published: (2002) -
The application of Pd nano-particles for copper seed layer electroless deposition in ULSI
by: 蔡昕辰
Published: (2002) -
Effects of Polyethyleneimine on Electroless Copper Deposition
by: Chen-Yu Huang, et al.
Published: (2015) -
Studies on the Function of Chelating Agents in Electroless Copper Sulfide Deposited Polyacrylonitrile on the EMI Shielding Effectiveness
by: Yen-Hung Chen, et al.
Published: (2009) -
Effect of Electroless Parameters on the Electroless Copper-Sulfide Structure for Electromagnetic Interference Shielding Electroless Copper Polyacrylonitrile Composites
by: Chang-cheng Chen, et al.
Published: (2008)