| Summary: | 碩士 === 雲林科技大學 === 工業工程與管理研究所碩士班 === 99 === With the personal electronic products for product portability, convenience, versatility and low-cost of the appeal, making the current PCB towards the short, fast, multi-functional, high I / O Development; In terms of the printed circuit board, HDI and IC substrate such as high-end PCB process capability presented is consistent with the product features of the basic products The rise of environmental consciousness, as well as the product manufacturing process in response to rising demands of reliability, add the Filer''s board is alsoincreasing.
By using Taguchi Method, and with statistical software analysis conducted into the number of sub-categories participating in the design. Nominal the best analysis confirmed that all future manufacturing process factors for the impact of different materials. Proven results show that income is indeed the best combination of factors and conditions of the high level of contribution to the glue residue quality.
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