Investigation On The Rheological Properties Of Silver Pastes

• Main Authors: Hsu, Chienpeng, 許謙鵬
• Other Authors: Hua, Chi-Chung
• Format: Others
• Language: en_US
• Published: 2012
• Online Access: http://ndltd.ncl.edu.tw/handle/15740347906963486276

碩士 === 國立中正大學 === 化學工程研究所 === 100 === Silver pastes have been widely used in the fabrication of front-side metallization for multi-crystalline silicon solar cells, aimed at printing fine lines with a high aspect ratio. Rheological features are very important to describe the paste behavior during printing, yet there was few or no study that differentiates the roles of inorganic and organic components, respectively. In this work, we investigated the rheological properties of a silver paste and its components under steady shear, frequency sweep, stress ramp, creep and strain recovery, single-step strain, and structure decomposition & recovery tests. The major findings are (i) distinct viscoelastic behaviors may correspond to a very similar steady-state viscosity curve, (ii) the organic component (i.e., the polymer), in general, has a greater influence on the results of all viscoelastic tests, and (iii) the screen printing tests show a poor printing quality of the inorganic component (i.e., the silver colloids). Accordingly, we discuss essential factors controlling the rheological properties of silver pastes.