The Effect of Minor Additions of Co upon Interfacial Reactions between Sn and Ag, Cu, and Ni Substrates and Sn-Co-Ag Ternary Phase Equilibria
碩士 === 中原大學 === 化學工程研究所 === 100 === Because of the property reinforcement of soldering joints, minor element alloying has attracted great attentions in Pb-free solders development. Among the alloying elements, Co is reported effective in reducing the undercooling of the solders, and is likely caused...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/72245323600109790021 |