Design, Fabrication and Measurement of the LED Packaging Module with Photosensor
碩士 === 逢甲大學 === 自動控制工程所 === 100 === This study proposes a LED silicon micro-packaging module with photosensor. The LED is integrated with the silicon substrate surface with p-n type photosensor directly by integrated micro process, and micro packaging mode is implemented by simple process of primary...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/whaq33 |