Design, Fabrication and Measurement of the LED Packaging Module with Photosensor
碩士 === 逢甲大學 === 自動控制工程所 === 100 === This study proposes a LED silicon micro-packaging module with photosensor. The LED is integrated with the silicon substrate surface with p-n type photosensor directly by integrated micro process, and micro packaging mode is implemented by simple process of primary...
Main Authors: | Kuo-Chun Tseng, 曾國鈞 |
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Other Authors: | Ching-Fu Tsou |
Format: | Others |
Language: | zh-TW |
Published: |
2012
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Online Access: | http://ndltd.ncl.edu.tw/handle/whaq33 |
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